Design, simulation, production and initial characterisation of 3D silicon detectors

被引:7
|
作者
Pennicard, D. [1 ]
Pellegrini, G. [2 ]
Lozano, M. [2 ]
Fleta, C. [1 ]
Bates, R. [1 ]
Parkes, C. [1 ]
机构
[1] Univ Glasgow, Dept Phys & Astron, Glasgow G12 8QQ, Lanark, Scotland
[2] IMB CNM CSIC, Inst Microelect Barcelona, Barcelona 08193, Spain
关键词
3D detectors; Semiconductor; Radiation hardness; LHC; RADIATION; PERFORMANCE; UPGRADE; LHC;
D O I
10.1016/j.nima.2008.08.077
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
3D detectors are photodiode radiation detectors with n- and p-type electrode columns passing through a silicon substrate. This structure makes it possible to achieve a very small electrode spacing without reducing the sensitive thickness. This greatly reduces the detector's depletion voltage and collection time, and hence improves its radiation hardness. This could make 3D detectors useful as pixel detectors for future high-luminosity colliders, such as the Super-LHC. The research institute IMB-CNM (Centro Nacional de Microelectronica, Barcelona) have produced 3D pad, pixel and strip detectors with a "double-sided 3D structure. This fabrication has been done alongside design and simulation work at the University of Glasgow. The first devices produced by CNM have been successfully IV and CV tested, and source tests are ongoing. Additionally, this conference record discusses work done by other 3D detector collaborations: Stanford, Manchester University and Sintef; FBK (Trento); and Glasgow, Diamond Light Source and IceMOS Ltd. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:67 / 70
页数:4
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