Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness process

In order to meet the demand for the current consumer electronic products, the improvement of the surface mount technology is an important trend. This study used the Taguchi method to develop different level schemes of the surface mount technology solder paste printing process parameter in order to obtain the conditions of parameter combinations of the surface mount technology solder paste printing process parameter. However, the Taguchi method of experimental configuration requires multiple trials to obtain the surface mount technology solder paste printing process parameter, which may require considerable cost and time. Therefore, this study attempted to use two multiattribute decision-making methods, gray relational analysis, and technique for order preference by similarity to ideal solution evaluating method, in order to determine a group of optimal experimental schemes from among the established multiple experimental schemes using the Taguchi method. This study also used the process capability parameter to verify the research methods. The experimental results showed that surface mount technology solder paste printing thickness process capability (C-pk) value has improved from 0.59 to 1.53, which could improve product quality. The Taguchi and two multiattribute decision-making methods have proven that the model can effectively obtain the surface mount technology solder paste printing thickness process parameter.