Optical interconnection technology on the printed circuit board level: Fundamentals - Technology - Design

被引：6
|
作者：
Griese, Elmar [1 ]
机构：
[1] Univ Siegen, Inst Theoret Elect Engn & Photon, D-57068 Siegen, Germany
来源：
PROCEEDINGS OF THE 2005 INTERNATIONAL STUDENTS AND YOUNG SCIENTISTS WORKSHOP PHOTONICS AND MICROSYSTEMS | 2005年
关键词：
D O I：
10.1109/STYSW.2005.1617794
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper presents the basic fundamentals of optical interconnection technology on the printed circuit board level. Different technology approaches for realizing board-integrated waveguides are presented and discussed. Moreover, the simulation and design of optical multimode interconnects within an electrical environment is addressed.
引用
收藏
页码：39 / 43
页数：5
相关论文
共 50 条
  • [31] Printed circuit board embedded power semiconductors: A technology review
    Huesgen T.
    Power Electronic Devices and Components, 2022, 3
  • [32] PRINTED-CIRCUIT BOARD TECHNOLOGY - ECONOMIC AND TECHNOLOGICAL OPPORTUNITIES
    KIRCHNER, E
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1989, 97 (05): : 183 - 184
  • [33] Multilayer Printed Circuit Board Production Using SMD Technology: Part 1. Design of a Radio Telephone and Radio Data Transmission Device, Printed Circuit Board Technology, SMD Components.
    Galla, Heinz
    F&M. Feinwerktechnik & Messtechnik, 1985, 93 (06): : 291 - 294
  • [34] YIG-tuned oscillator design on printed circuit board using surface mount technology
    Muhammad Afifi, Amir Effendy
    2006 International RF and Microwave Conference, Proceedings, 2006, : 160 - 164
  • [35] Integrated Design and Manufacturing of Flat Miniature Heat Pipes Using Printed Circuit Board Technology
    Wits, Wessel W.
    Vaneker, Tom H. J.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (02): : 398 - 408
  • [36] A Capacitive Fringing Field Sensor Design for Moisture Measurement Based on Printed Circuit Board Technology
    Dean, Robert Neal
    Rane, Aditi Kiran
    Baginski, Michael E.
    Richard, Jonathan
    Hartzog, Zane
    Elton, David J.
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2012, 61 (04) : 1105 - 1112
  • [37] Highly reliable optical interconnection network on printed circuit board for distributed computer systems
    Yu, Zhihua
    Luo, Fengguang
    Di, Xu
    Zhou, Weilin
    Li, Bin
    Wang, Guangjun
    Chen, Jun
    OPTICS AND LASER TECHNOLOGY, 2010, 42 (08): : 1332 - 1336
  • [38] Development Status and Trend of Board-Level Photoelectric Interconnection Technology
    Du Yaohui
    Hou Xia
    LASER & OPTOELECTRONICS PROGRESS, 2024, 61 (07)
  • [39] Technology trends of embedded printed circuit board from the viewpoint of patents
    1600, Japan Institute of Electronics Packaging (24): : 56 - 62
  • [40] Micropump Pattern Replication Using Printed Circuit Board (PCB) Technology
    Chee, Pei Song
    Arsat, Rashidah
    Hashim, Uda
    Rahim, Ruzairi Abdul
    Leow, Pei Ling
    MATERIALS AND MANUFACTURING PROCESSES, 2013, 28 (06) : 702 - 706
12345