Electrodeposition of Copper in the Presence of Aliphatic and Aromatic Diamines as Organic Additives

Effect of amines as organic additives on copper electrodeposition from acidic sulphate solutions were investigated by different electrochemical methods [potentio-dynamic method, rotating cylinder electrode (RCE) and rotating disk electrode (RDE)] as well as by observation technique [scanning electron microscopy (SEM)] which reveal that the surface morphology was affected by the nature of the organic additives to a large extent. This means that the shape of dendrites depends on the composition of plating solution. The correlation between % inhibition and the molecular structure of amines as group of nitrogen containing organic compounds has been extensively investigated. Different models of adsorption isotherm, thermodynamic parameters, and dimensionless group correlation have been studied to understand the effect of such amines on the electrodeposition process. (C) The Electrochemical Society of Japan, All rights reserved.