A Study of On-Chip Stacked Multiloop Spiral Inductors

被引:14
|
作者
Yang, Kai [1 ]
Yin, Wen-Yan [1 ]
Shi, Jinglin [2 ]
Kang, Kai [2 ]
Mao, Jun-Fa [1 ]
Zhang, Y. P. [3 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Ctr Microwave & RF Technol, Shanghai 200240, Peoples R China
[2] Inst Microelect, Integrated Circuits & Syst Lab, Singapore 117685, Singapore
[3] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
关键词
Differential topology; inductance; partial-element equivalent-circuit (PEEC) method; patterned ground shields (PGSs); Q-factor; resistance; stacked multiloop spiral inductors;
D O I
10.1109/TED.2008.2004648
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper proposes a new differential topology that features a stacked multiloop inductor. Comparative studies of stacked one- to four-loop spiral inductors with and without patterned ground shields (PGSs) for silicon-based radio-frequency integrated circuits (RFICs) were conducted, and lumped-element circuit models were developed for these inductors. The partial-element equivalent-circuit method that can accurately analyze mutual inductive couplings among different spirals in these multiloop geometries was employed for capturing the frequency-dependent inductances and resistances of inductors at low frequencies. A good agreement between numerical results and measurements is obtained. It is demonstrated that a stacked multiloop spiral inductor with differential topology and PGS has a larger inductance and a higher Q-factor as compared with the same inductor without differential topology and PGS. This hybrid methodology could provide a promising technique for developing new silicon-based passive devices used in RFICs.
引用
收藏
页码:3236 / 3245
页数:10
相关论文
共 50 条
  • [41] A Substrate Model for On-Chip Tapered Spiral Inductors With Forward and Reverse Excitations
    Sathyasree, J.
    Vanukuru, Venkata
    Nair, Deleep R.
    Chakravorty, Anjan
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) : 802 - 805
  • [42] Experimental characterization of on-chip single and double-coupling spiral inductors
    Kang, K
    Yeo, TS
    Shi, JL
    Wu, B
    [J]. INTERNATIONAL JOURNAL OF INFRARED AND MILLIMETER WAVES, 2004, 25 (10): : 1535 - 1544
  • [43] Frequency-Independent T Equivalent Circuit for On-Chip Spiral Inductors
    Wei, Jiaju
    Wang, Zhigong
    [J]. IEEE ELECTRON DEVICE LETTERS, 2010, 31 (09) : 933 - 935
  • [44] Experimental Characterization of On-Chip Single and Double-Coupling Spiral Inductors
    Kai Kang
    Tao-Soon Yeo
    Jinglin Shi
    Bin Wu
    [J]. International Journal of Infrared and Millimeter Waves, 2004, 25 : 1535 - 1544
  • [45] Double- pi fully scalable model for on-chip spiral inductors
    Liu Jun
    Zhong Lin
    Wang Huang
    Wen Jincai
    Sun Lingling
    Yu Zhiping
    Condon, Marissa
    [J]. JOURNAL OF SEMICONDUCTORS, 2012, 33 (08)
  • [46] A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors
    Bing Hou
    Tong Liu
    Jun Liu
    Junli Chen
    Faxin Yu
    Wenbo Wang
    [J]. Journal of Electronic Testing, 2016, 32 : 649 - 652
  • [47] Scalable distributed-capacitance model for silicon on-chip spiral inductors
    Huang, Fengyi
    Lu, Jingxue
    Jiang, Nan
    [J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2006, 48 (07) : 1423 - 1427
  • [48] A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors
    Hou, Bing
    Liu, Tong
    Liu, Jun
    Chen, Junli
    Yu, Faxin
    Wang, Wenbo
    [J]. JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2016, 32 (05): : 649 - 652
  • [49] Transfer Function Analysis and Broadband Scalable Model for On-Chip Spiral Inductors
    Wang, Huang
    Sun, Lingling
    Liu, Jun
    Zou, Huanhuan
    Yu, Zhiping
    Gao, Jianjun
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (07) : 1696 - 1708
  • [50] Scalable Modeling of On-chip Spiral Inductors including Metal Fill Parasitics
    Shilimkar, Vikas S.
    Gaskilll, Steven G.
    Weisshaar, Andreas
    [J]. 2014 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2014,