Ozonated water for photoresist removal

被引：0
|
作者：
Nelson, S [1 ]
机构：
[1] FSI Int, Chaska, MN 55318 USA
来源：
SOLID STATE TECHNOLOGY | 1999年 / 42卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Processes using ozonated DI water for resist stripping and surface cleaning can reduce conventional chemical usage and operating costs, and improve process performance and yield. Improvements in ozone-generation equipment have made it possible to prepare supersaturated DIO3, maximizing stripping efficiency. In addition, ozonated water additives can prevent unwanted radical reactions that lead to the decomposition of the ozone; this step is essential for stripping metallized wafers.
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页码：107 / +
页数：4
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