An Ultra-Miniaturized Transceiver Module for Bluetooth Applications Using 3-D LTCC System-On-Package Technology

被引：0
|
作者：
Cho, Yun-Hee [1 ]
Kim, Jin-Wan [1 ]
Park, Yun-Hwi [1 ]
机构：
[1] Samsung Electromech, Electro Mat & Device Lab, Corp R&D Inst, Suwon 443803, Gyoung Gi, South Korea
来源：
2008 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4 | 2008年
关键词：
LTCC; embedded; Bluetooth;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, an ultra miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology is presented. The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filter, balun, matching circuit, resistor, RF choke and bypass capacitor in order to reduce the overall size of module. The whole size of module is as small as 4.3 x 4.1 x 1.2 mar, which is the smallest size in the Bluetooth modules. The fabricated Bluetooth module reveals a transmit power of over 1 dBm and a sensitivity of -83 dBm.
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页码：1 / 4
页数：4
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