Failure detection on PCBs: an image processing based approach

被引：0

作者：

Sipos, Emilia ^{[1
]}

Ones, Alexandra ^{[1
]}

Groza, R. ^{[1
]}

机构：

[1] Tech Univ Cluj Napoca, Bases Elect Dept, Cluj Napoca, Romania

来源：

2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019) | 2019年

关键词：

thermal camera; optical camera; decision tree; MATLAB;

D O I：

10.1109/siitme47687.2019.8990713

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The concern to identify methods to obtain low cost levels in testing printed circuit boards is an important issue in quality assurance. In this paper, a fast and low cost testing system is proposed, based on images captured using optical and thermal cameras. The images are divided into blocks; all blocks are compared with reference blocks provided by reference images. Our system detects the differences and delivers a message with the name of the device or the group of devices that fail. Next, a decision tree is used, to set the trajectory of the tested board.

引用

页码：375 / 378

页数：4

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