Failure detection on PCBs: an image processing based approach

被引：0
|
作者：
Sipos, Emilia [1 ]
Ones, Alexandra [1 ]
Groza, R. [1 ]
机构：
[1] Tech Univ Cluj Napoca, Bases Elect Dept, Cluj Napoca, Romania
来源：
2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019) | 2019年
关键词：
thermal camera; optical camera; decision tree; MATLAB;
D O I：
10.1109/siitme47687.2019.8990713
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The concern to identify methods to obtain low cost levels in testing printed circuit boards is an important issue in quality assurance. In this paper, a fast and low cost testing system is proposed, based on images captured using optical and thermal cameras. The images are divided into blocks; all blocks are compared with reference blocks provided by reference images. Our system detects the differences and delivers a message with the name of the device or the group of devices that fail. Next, a decision tree is used, to set the trajectory of the tested board.
引用
收藏
页码：375 / 378
页数：4
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