Characterization of a 3.3-kV Si-SiC Hybrid Power Module in Half-Bridge Topology for Traction Inverter Application

被引:17
|
作者
Li, Daohui [1 ]
Li, Xiang [1 ]
Chang, Guiqin [2 ]
Qi, Fang [2 ]
Packwood, Matthew [1 ]
Pottage, Daniel [1 ]
Wang, Yangang [1 ]
Luo, Haihui [2 ]
Dai, Xiaoping [2 ]
Liu, Guoyou [2 ]
机构
[1] Dynex Semicond Ltd, Res & Dev Ctr, Lincoln LN6 3LF, England
[2] China Railway Rolling Stock Corp, State Key Lab Adv Power Semicond Device, Zhuzhou 412000, Peoples R China
关键词
Half-bridge toplogy; silicon (Si) carbide; Si silicon carbide (SiC) hybrid; traction inverter; IGBT/SIC-JBS DIODE; PERFORMANCE; DESIGN; INDUCTANCE; CONVERTERS;
D O I
10.1109/TPEL.2020.2995698
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A state-of-the-art 33-kV/450-A hybrid power module for the next generation traction inverter of rolling stock is reported in this paper, combining the silicon (Si) insulated-gate bipolar transistor (IGBT) and silicon carbide Schottky barrier diodes (SBDs) chips. Compared with the existing hybrid technology at the same voltage level, this module is characterized by a half-bridge topology, in which 6 IGBT and 12 SBD chips are integrated in each switch. The outnumbering of the diodes represents a promising mitigation to the low availability of SBDs at this voltage level. Both static and dynamic test of this module and an equivalent Si-based module are carried out comparatively. Apart from describing the features of compactness, low-inductance, and good current distribution among chips, this module is characterized by low turn-ON current overshooting and turn-ON loss of IGBTs, negligible diode reverse recovery time and loss, as well as flexible allowance of IGBT turn-ON current rising rate dI/dt. A parameterized study is carried out to benchmark the advantage of this new topology. Based on the experimental results, the performance of the hybrid module in a three-phase traction inverter circuit is also evaluated by means of electro-thermal simulation. The hybrid module distinguishes itself by describing much lower power loss and junction temperature than its Si-based counterpart.
引用
收藏
页码:13429 / 13440
页数:12
相关论文
共 50 条
  • [31] Electrothermal Modeling, Simulation, and Electromagnetic Characterization of a 3.3 kV SiC MOSFET Power Module
    Scognamillo, C.
    Catalano, A. P.
    Borghese, A.
    Riccio, M.
    d'Alessandro, V
    Breglio, G.
    Trace, A.
    Tripathi, R. N.
    Castellazzi, A.
    Codecasa, L.
    2021 33RD INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2021, : 123 - 126
  • [32] SiC-hybrid based railway inverter for metro application with 3.3kV low inductance power modules
    Rujas, Alejandro
    Lopez, Victor M.
    Villar, Irma
    Nieva, Txomin
    Larzabal, Ivan
    2019 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2019, : 1992 - 1997
  • [33] Power Cell Design and Assessment Methodology Based on a High-Current 10-kV SiC MOSFET Half-Bridge Module
    Mocevic, Slavko
    Yu, Jianghui
    Xu, Yue
    Stewart, Joshua
    Wang, Jun
    Cvetkovic, Igor
    Dong, Dong
    Burgos, Rolando
    Boroyevich, Dushan
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2021, 9 (04) : 3916 - 3935
  • [34] 3.3 kV/1500A power modules for the world's first all-SiC traction inverter
    Hamada, Kenji
    Hino, Shiro
    Miura, Naruhisa
    Watanabe, Hiroshi
    Nakata, Shuhei
    Suekawa, Eisuke
    Ebiike, Yuji
    Imaizumi, Masayuki
    Umezaki, Isao
    Yamakawa, Satoshi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2015, 54 (04)
  • [35] High Power Density 1700-V/ 300-A Si-IGBT and SiC-MOSFET Hybrid Switch-based Half-bridge Power Module
    Deshpande, Amol
    Imran, Asif
    Paul, Riya
    Yuan, Zhao
    Peng, Hongwu
    Luo, Fang
    2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2020, : 3979 - 3986
  • [36] 3.3kV SiC Hybrid Module with High Power next Core ( HPnC) Package
    Sekino, Yusuke
    Heinzel, Thomas
    Hofmann, Daniel
    Iso, Akira
    Sawada, Mutsumi
    Harada, Yuichi
    Moriya, Tomohiro
    Iwamoto, Susumu
    Kakiki, Hideaki
    Osamu, Ikawa
    2017 19TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'17 ECCE EUROPE), 2017,
  • [37] Switching Characterization of SiC Half Bridge Module for High Power Density Converter
    Yin, Shan
    Tseng, K. J.
    Tong, C. F.
    Simanjorang, Rejeki
    Gajanayake, C. J.
    Gupta, Amit K.
    2015 IEEE INTERNATIONAL TELECOMMUNICATIONS ENERGY CONFERENCE (INTELEC), 2015,
  • [38] 6.5 kV Si/SiC Hybrid Power Module: An Ideal Next Step?
    Huang, Alex Q.
    Song, Xiaoqing
    Zhang, Liqi
    2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 64 - 67
  • [39] Packaging and Characterization of an Ultra Compact 1200V PCB SiC MOSFET Half-Bridge Module
    Hsu, Wei-Jung
    Tong, Junhong
    Huang, Qingyun
    Huang, Alex Q.
    2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, 2023, : 2604 - 2608
  • [40] An Improved Lateral-coupling Thermal Impedance Model of a Half-Bridge Power Module under Inverter Operations
    Wang, Xuemei
    Yuan, Xun
    Sang, Yalei
    45TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2019), 2019, : 3142 - 3147