Characterization of a 3.3-kV Si-SiC Hybrid Power Module in Half-Bridge Topology for Traction Inverter Application

被引:17
|
作者
Li, Daohui [1 ]
Li, Xiang [1 ]
Chang, Guiqin [2 ]
Qi, Fang [2 ]
Packwood, Matthew [1 ]
Pottage, Daniel [1 ]
Wang, Yangang [1 ]
Luo, Haihui [2 ]
Dai, Xiaoping [2 ]
Liu, Guoyou [2 ]
机构
[1] Dynex Semicond Ltd, Res & Dev Ctr, Lincoln LN6 3LF, England
[2] China Railway Rolling Stock Corp, State Key Lab Adv Power Semicond Device, Zhuzhou 412000, Peoples R China
关键词
Half-bridge toplogy; silicon (Si) carbide; Si silicon carbide (SiC) hybrid; traction inverter; IGBT/SIC-JBS DIODE; PERFORMANCE; DESIGN; INDUCTANCE; CONVERTERS;
D O I
10.1109/TPEL.2020.2995698
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A state-of-the-art 33-kV/450-A hybrid power module for the next generation traction inverter of rolling stock is reported in this paper, combining the silicon (Si) insulated-gate bipolar transistor (IGBT) and silicon carbide Schottky barrier diodes (SBDs) chips. Compared with the existing hybrid technology at the same voltage level, this module is characterized by a half-bridge topology, in which 6 IGBT and 12 SBD chips are integrated in each switch. The outnumbering of the diodes represents a promising mitigation to the low availability of SBDs at this voltage level. Both static and dynamic test of this module and an equivalent Si-based module are carried out comparatively. Apart from describing the features of compactness, low-inductance, and good current distribution among chips, this module is characterized by low turn-ON current overshooting and turn-ON loss of IGBTs, negligible diode reverse recovery time and loss, as well as flexible allowance of IGBT turn-ON current rising rate dI/dt. A parameterized study is carried out to benchmark the advantage of this new topology. Based on the experimental results, the performance of the hybrid module in a three-phase traction inverter circuit is also evaluated by means of electro-thermal simulation. The hybrid module distinguishes itself by describing much lower power loss and junction temperature than its Si-based counterpart.
引用
收藏
页码:13429 / 13440
页数:12
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