Challenges in high-density PCB assembly: New strategies for improving quality inspection and test

被引：0
|
作者：
De Marco, AI [1 ]
机构：
[1] Mfg Serv, Valencia, Spain
来源：
SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM | 1999年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：473 / 484
页数：12
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