A new thermally conductive die attach film with low stress and excellent reliability

被引：0
|
作者：
Masuko, T [1 ]
Hayashi, H [1 ]
Takeda, S [1 ]
Morikawa, J [1 ]
Hashimoto, T [1 ]
机构：
[1] Hitachi Chem Co Ltd, R&D Ctr, Hitachi, Ibaraki, Japan
来源：
2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 2001年 / 4587卷
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：741 / 744
页数：4
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