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- [2] LOW-TEMPERATURE SILVER GLASS DIE ATTACH MATERIAL PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 640 - 655
- [3] The Evolutions of Microstructure in Pressureless Sintered Silver Die Attach Material INTERNATIONAL JOURNAL OF NANOELECTRONICS AND MATERIALS, 2021, 14 (02): : 179 - 194
- [4] Synthesis of silver nanorods and application for die attach material in devices Journal of Materials Science: Materials in Electronics, 2010, 21 : 713 - 718
- [6] Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging Journal of Materials Science: Materials in Electronics, 2017, 28 : 5446 - 5451
- [8] Low Stress Die Attach Material Challenges for Critical Si Node with Cu Wire 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 80 - 83
- [9] Silver Micropowders as SiC Die Attach Material for High Temperature Applications 2012 35TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2012): POWER ELECTRONICS, 2012, : 144 - 148