Impact of Al-Ion Implantation on the Formation of Deep Defects in n-Type 4H-SiC

被引:0
|
作者
Weisse, Julietta [1 ]
Csato, Constantin [2 ]
Hauck, Martin [3 ]
Erlekampf, Jurgen [4 ]
Akhmadaliev, Shavkat [5 ]
Rommel, Mathias [4 ]
Mitlehner, Heinz [4 ]
Rueb, Michael [6 ]
Krieger, Michael [3 ]
Bauer, Anton [4 ]
Haeublein, Volker [4 ]
Erlbacher, Tobias [4 ]
Frey, Lothar [4 ]
机构
[1] Friedrich Alexander Univ Erlangen Nuremberg, Chair Electron Devices, Erlangen, Germany
[2] Mi2 Factory GmbH, Jena, Germany
[3] Friedrich Alexander Univ Erlangen Nuremberg, Chair Appl Phys, Erlangen, Germany
[4] Fraunhofer IISB, Erlangen, Germany
[5] Helmholtz Zentrum Dresden Rossendorf, Dresden, Germany
[6] Mi2 Factory GmbH, Ernst Abbe Hsch Jena, Jena, Germany
关键词
aluminum; high energy ion implantation; energy filter implantation; EFII; defects; compensation; Deep Level Transient Spectroscopy; DLTS; Hall Effect; 4H-SiC;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this work, deep defects in an aluminum-implanted 4H-SiC n-type epitaxy are discussed in dependence on following influencing factors: concentration of implanted aluminum, implantation energy, implantation at 500 degrees C and at room temperature, as well as ascending or descending order of implantation energies during ion implantation using Gaussian profiles. The compensation ratio, which reaches values up to 90% of the implanted aluminum concentration, is determined by Hall Effect measurements. Compensating defect centers (Z(1/2)-, ONx-defects) are detected by Deep Level Transient Spectroscopy after high energy ion implantation using an energy filter, followed by an annealing and an oxidation process.
引用
收藏
页码:66 / 69
页数:4
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