Development of planar antennas in multi-layer packages for RF-system-on-a-package applications

被引：15
|
作者：
Lim, K [1 ]
Obatoyinbo, A [1 ]
Davis, M [1 ]
Laskar, J [1 ]
Tummala, R [1 ]
机构：
[1] Georgia Inst Technol, NSF Packaging Res Ctr, Atlanta, GA 30332 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2001年
关键词：
D O I：
10.1109/EPEP.2001.967621
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The integration of an antenna with a RF module is an attractive solution for realizing a small size and low cost wireless transceiver. In this paper, multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fire ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.
引用
收藏
页码：101 / 104
页数：4
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