Preparation of porous alumina abrasives with different morphologies and their chemical mechanical polishing behavior

被引：2
|
作者：
Wu, Xin [1 ]
Lei, Hong [1 ]
Chen, Ruling [1 ]
机构：
[1] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China
来源：
PRODUCT DESIGN AND MANUFACTURING | 2011年 / 338卷
关键词：
Chemical mechanical polishing (CMP); Porous alumina abrasives; Different morphologies; Hard disk substrate; Planarization;
D O I：
10.4028/www.scientific.net/AMR.338.415
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The traditional solid alumina abrasive has been widely used in commercial slurries. But it is easy to cause polishing scratches due to its dense solid structure. The morphology of the abrasives can also impact on the chemical mechanical polishing (CMP) performances. To improve the CMP performances of the hard disk substrate, rods-like porous alumina and flower-like porous alumina abrasives were prepared and their chemical mechanical polishing behavior investigated. The results showed that the porous alumina abrasives with different morphologies exhibited lower topographical variations and surface roughness than solid alumina abrasives under the same testing conditions.
引用
收藏
页码：415 / 420
页数：6
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