Preparation of porous alumina abrasives with different morphologies and their chemical mechanical polishing behavior

被引：2
|
作者：
Wu, Xin [1 ]
Lei, Hong [1 ]
Chen, Ruling [1 ]
机构：
[1] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China
来源：
PRODUCT DESIGN AND MANUFACTURING | 2011年 / 338卷
关键词：
Chemical mechanical polishing (CMP); Porous alumina abrasives; Different morphologies; Hard disk substrate; Planarization;
D O I：
10.4028/www.scientific.net/AMR.338.415
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The traditional solid alumina abrasive has been widely used in commercial slurries. But it is easy to cause polishing scratches due to its dense solid structure. The morphology of the abrasives can also impact on the chemical mechanical polishing (CMP) performances. To improve the CMP performances of the hard disk substrate, rods-like porous alumina and flower-like porous alumina abrasives were prepared and their chemical mechanical polishing behavior investigated. The results showed that the porous alumina abrasives with different morphologies exhibited lower topographical variations and surface roughness than solid alumina abrasives under the same testing conditions.
引用
收藏
页码：415 / 420
页数：6
相关论文
共 50 条
  • [1] Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
    Lei, Hong
    Wu, Xin
    Chen, Ruling
    THIN SOLID FILMS, 2012, 520 (07) : 2868 - 2872
  • [2] Effect of different abrasives on chemical mechanical polishing for magnesia alumina spinel
    Wang Z.
    Pang M.
    Su J.
    Yao J.
    Key Engineering Materials, 2020, 866 : 115 - 124
  • [3] Preparation of porous alumina/ceria composite abrasive and its chemical mechanical polishing behavior
    Chen, Sisi
    Lei, Hong
    Chen, Ruling
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2013, 31 (02):
  • [4] Preparation of -alumina/silica core-shell abrasives and their chemical mechanical polishing performances on sapphire substrates
    Wang, Xin
    Lei, Hong
    MICRO & NANO LETTERS, 2018, 13 (09): : 1315 - 1320
  • [5] Preparation of CeO2 nanoparticles and their chemical mechanical polishing as abrasives
    Li, Xia-Zhang
    Chen, Yang
    Chen, Zhi-Gang
    Chen, Jian-Qing
    Ni, Chao-Ying
    Mocaxue Xuebao/Tribology, 2007, 27 (01): : 1 - 5
  • [6] A suspending abrasives and porous pad model for the analysis of lubrication in chemical mechanical polishing
    Liu, J. Y.
    Guo, D. M.
    Jin, Z. J.
    Kang, R. X.
    ADVANCES IN MACHINING & MANUFACTURING TECHNOLOGY VIII, 2006, 315-316 : 775 - 778
  • [7] Preparation of α-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior
    Lei, Hong
    Lu, Haishen
    Luo, Jianbin
    Lu, Xinchun
    THIN SOLID FILMS, 2008, 516 (10) : 3005 - 3008
  • [8] Preparation of Surface Modified Ceria Nanoparticles as Abrasives for the Application of Chemical Mechanical Polishing (CMP)
    Cheng, Jie
    Huang, Shuo
    Lu, Xinchun
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2020, 9 (02)
  • [9] Chemical–mechanical polishing of copper and tantalum with silica abrasives
    Y. Li
    M. Hariharaputhiran
    S. V. Babu
    Journal of Materials Research, 2001, 16 : 1066 - 1073
  • [10] Preparation of Cu-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates
    Hong Lei
    Qian Gu
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 10194 - 10200
12345