Study on bending deformation of ultra-thin floating glass plate

被引:4
|
作者
Lin, Jian [1 ]
Cai, Limao [2 ]
Tian, Yingliang [1 ]
Han, Zhengwei [2 ]
Xiang, Zhilei [1 ]
机构
[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
[2] Hebei Window Glass Co Ltd, Langfang 065600, Peoples R China
基金
北京市自然科学基金; 中国国家自然科学基金;
关键词
Ultra-thin float glass; Bending deformation; Tin ion permeation; Numerical simulation;
D O I
10.1016/j.jnoncrysol.2020.120172
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The bending deformation caused by chemical strengthening is often thought as a negative factor on the performance of the ultra-thin glass plate. It becomes serious with the thickness of the ultra-thin glass plate getting smaller. The mechanism of the bending deformation was analyzed in this paper. The key factors including thermal history and micro structure variation caused by tin penetration were discussed accordingly. A numerical model was proposed to predict the bending deformation during manufacturing and chemical strengthening procedures. It was validated by bending deformation measurement. It is shown that after chemical strengthening the glass plate bends toward the upper (atmosphere) surface. The tin ion penetration during floating is an important factor to cause bending deformation in chemical strengthening stage.
引用
收藏
页数:11
相关论文
共 50 条
  • [41] Polysilicon thin film developed on ultra-thin flexible glass for temperature sensor
    Quintana, Juan M.
    Nguyen, Thinh H.
    Ahn, Chong H.
    2020 IEEE SENSORS, 2020,
  • [42] Flexible substrate with floating island structure for mounting ultra-thin silicon chips
    Takeshita, Toshihiro
    Takei, Yusuke
    Yamashita, Takahiro
    Oouchi, Atsushi
    Kobayashi, Takeshi
    FLEXIBLE AND PRINTED ELECTRONICS, 2020, 5 (02):
  • [43] Floating body and hot carrier effects in ultra-thin film SOI MOSFETs
    Renn, SH
    Raynaud, C
    Balestra, F
    JOURNAL DE PHYSIQUE IV, 1996, 6 (C3): : 49 - 54
  • [44] Study on microstructure and properties of double ultra-thin stainless steel clad plate by laser welding
    Wang W.
    Zhang Y.
    Cui Z.
    Yan X.
    Zhongguo Jiguang/Chinese Journal of Lasers, 2011, 38 (05):
  • [45] Electrochemical study of ultra-thin silicon oxides
    Bertagna, V
    Erre, R
    Petitdidier, S
    Lévy, D
    Chemla, M
    CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING VII, PROCEEDINGS, 2002, 2002 (26): : 211 - 217
  • [46] Numerical study on the size effect in the ultra-thin sheet's micro-bending forming process
    Li, L.
    Zhou, Q.
    Zhou, Y. Y.
    Cao, J. G.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 499 (1-2): : 32 - 35
  • [47] Ultra-thin plasmonic optical vortex plate based on phase discontinuities
    Genevet, Patrice
    Yu, Nanfang
    Aieta, Francesco
    Lin, Jiao
    Kats, Mikhail A.
    Blanchard, Romain
    Scully, Marlan O.
    Gaburro, Zeno
    Capasso, Federico
    APPLIED PHYSICS LETTERS, 2012, 100 (01)
  • [48] Study on ultra-thin AlGaAs layer on GaAs
    Wuli Xuebao, 8 (1616-1617):
  • [49] Experimental and theoretical study of ultra-thin oxides
    Daniel, ES
    Ting, DZY
    McGill, TC
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1998, 13 (8A) : A155 - A159
  • [50] Transport study of ultra-thin SOI MOSFETs
    Naser, B
    Cho, KH
    Hwang, SW
    Bird, JP
    Ferry, DK
    Goodnick, SM
    Park, BG
    Ahn, D
    PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES, 2003, 19 (1-2): : 39 - 43