Analytical solutions of film planarization for periodic features

被引：10
|
作者：
Wu, PY [1 ]
Chou, FC [1 ]
Gong, SC [1 ]
机构：
[1] Natl Cent Univ, Dept Mech Engn, Chungli 320, Taiwan
来源：
JOURNAL OF APPLIED PHYSICS | 1999年 / 86卷 / 08期
关键词：
D O I：
10.1063/1.371417
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Analytical solutions of film profiles and degree of planarization for periodic features during the spin coating process are presented. This article shows that the degree of planarization is independent of Omega(2) and changes slightly with the dimensionless line spacing alpha for Omega(2)> 300. The governing dimensionless parameter Omega(2) represents the ratio of centrifugal force to surface tension force during spin coating. In the cases of low Omega(2) (Omega(2)< 1), the degree of planarization decreases with increasing alpha for a fixed Omega(2). (C) 1999 American Institute of Physics. [S0021-8979(99)05120-8].
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页码：4657 / 4659
页数：3
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