Distributed microwave MCM-D circuits for X- and K-band applications

被引：0
|
作者：
Pieters, P [1 ]
Brebels, S [1 ]
De Raedt, W [1 ]
Beyne, E [1 ]
机构：
[1] IMEC, MCP MCM Grp, B-3001 Louvain, Belgium
来源：
1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS | 1999年 / 3830卷
关键词：
MCM-D; multilayer microwave circuits; lange coupler; broadband coupler; balun;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Future telecommunication applications will shift more and more to the use of higher frequencies. At these high frequencies, lumped passive components can no longer be used and distributed circuits have to be employed instead. This paper introduces such distributed microwave circuits integrated in thin film MCM-D technology. First, a fast and general high frequency analysis and design method for structures in a multilayer configuration is presented. Then, through the examples of broadband couplers and baluns, the design and realization of distributed circuits integrated in MCM-D is demonstrated.
引用
收藏
页码：444 / 449
页数：6
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