Thermal impedance measurement of a self-heating probe

被引：0
|
作者：
Horn, M [1 ]
机构：
[1] Univ Bundeswehr Munich, Inst Measurement & Automat, D-85577 Neubiberg, Germany
来源：
2005 IEEE SENSORS, VOLS 1 AND 2 | 2005年
关键词：
D O I：
暂无
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
In case of large temperature dependencies of the properties, due to sufficient high voltages and currents the power dissipation in electric devices causes 'virtual' electrical impedances. The reason is the thermal impedance, which is determined by the inside structure and the environmental conditions. For many fields in solid-state circuit design and sensor applications, the actual value of the thermal impedance bears important information about the state of the device and its surroundings. In the paper it is shown, how the actual value of the thermal impedance can be determined directly from the continuously measured virtual electrical impedance.
引用
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页码：904 / 907
页数：4
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