Effect of flow pattern on the segregation of impurities in vertical Bridgman growth of multi-crystalline silicon

被引:14
|
作者
Bellmann, M. P. [1 ]
M'Hamdi, M. [2 ]
机构
[1] SINTEF Mat & Chem, N-7465 Trondheim, Norway
[2] SINTEF Mat & Chem, N-0315 Oslo, Norway
关键词
Segregation; Convection; Numerical simulation; Impurities; Growth from melt; Solar cell; DIRECTIONAL SOLIDIFICATION; MULTICRYSTALLINE SILICON; SOLAR-CELLS; CONVECTION; BUOYANCY;
D O I
10.1016/j.jcrysgro.2011.10.055
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Numerical experiments are used to study thermally driven flow during directional solidification of multi-crystalline (mc) silicon. A solid-liquid (s-l) interface shape was imposed by varying the absolute value and the direction of the radial temperature gradient in the melt. The flow pattern and the final impurity distribution were calculated for a solidification process with a planar, concave and convex s-l interface shape. When solidification with a planar s-l interface occurs the flow intensity is low and the impurity segregation is diffusion controlled and nearly uniform in radial direction. With concave and convex s-l interfaces the flow intensity becomes one order of magnitude higher. If a concave interface occurs impurities are transported towards the center of the ingot and radial segregation increases. The flow direction reverses when the interface becomes convex and the impurities are carried more effectively away from the interface to the bulk of the melt. It is for this case that the most uniform radial distribution was obtained. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:93 / 98
页数:6
相关论文
共 50 条
  • [21] Dynamic simulation of impurity transport and chemical reactions in a Bridgman furnace for directional solidification of multi-crystalline silicon
    Bellmann, M. P.
    Panjwani, B.
    Syvertsen, M.
    Meese, E. A.
    JOURNAL OF CRYSTAL GROWTH, 2013, 369 : 47 - 54
  • [22] Improvement of multi-crystalline silicon ingot growth by using diffusion barriers
    Hsieh, C. C.
    Lan, A.
    Hsu, C.
    Lan, C. W.
    JOURNAL OF CRYSTAL GROWTH, 2014, 401 : 727 - 731
  • [23] The effect of heating power on impurity formation and transport during the holding phase in a Bridgman furnace for directional solidification of multi-crystalline silicon
    Ellingsen, Kjerstin
    Lindholm, Dag
    M'Hamdi, Mohammed
    JOURNAL OF CRYSTAL GROWTH, 2016, 444 : 39 - 45
  • [24] Fast growth of thin multi-crystalline silicon ribbons by the RST method
    Heilbronn, Bertrand
    De Moro, Fabrice
    Jolivet, Emilie
    Tupin, Elsa
    Chau, Benjamin
    Varrot, Romain
    Drevet, Beatrice
    Bailly, Severine
    Rey, Delphine
    Lignier, Helene
    Xi, Yinghao
    Riberi-Beridot, Thecle
    Mangelinck-Noel, Nathalie
    Reinhart, Guillaume
    Regula, Gabrielle
    CRYSTAL RESEARCH AND TECHNOLOGY, 2015, 50 (01) : 101 - 114
  • [25] Growth of multi-crystalline silicon on seeded glass from metallic solutions
    Silier, I
    Gutjahr, A
    Banhart, F
    Konuma, M
    Bauser, E
    Schollkopf, V
    Frey, H
    MATERIALS LETTERS, 1996, 28 (1-3) : 87 - 91
  • [26] Effect of power ratio of side/top heaters on the performance and growth of multi-crystalline silicon ingots
    Peng, Yinqiao
    Feng, Tianshu
    Zhou, Jicheng
    MATERIALS LETTERS, 2022, 306
  • [27] Optimizing oxygen impurities using different heater design in the directional solidification of multi-crystalline silicon
    Kesavan, V
    Srinivasan, M.
    Ramasamy, P.
    MATERIALS RESEARCH EXPRESS, 2019, 6 (10)
  • [28] Silicon feedstock for the multi-crystalline photovoltaic industry
    Sarti, D
    Einhaus, R
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2002, 72 (1-4) : 27 - 40
  • [29] Study on Multi-crystalline Silicon Textured by ultrasound
    Chao Yan
    Wu Liqun
    Luo Xiaolu
    MECHANICAL AND ELECTRONICS ENGINEERING III, PTS 1-5, 2012, 130-134 : 50 - 53
  • [30] The effect of moisture on the degradation mechanism of multi-crystalline silicon photovoltaic module
    Kim, T. H.
    Park, N. C.
    Kim, D. H.
    MICROELECTRONICS RELIABILITY, 2013, 53 (9-11) : 1823 - 1827