Efficient CMOS Systems With Beam-Lead Interconnects for Space Instruments

被引:7
|
作者
Chahat, Nacer [1 ,2 ]
Tang, Adrian [2 ]
Lee, Choonsup [2 ]
Sauleau, Ronan [1 ]
Chattopadhyay, Goutam [2 ]
机构
[1] Univ Rennes 1, UMR CNRS 6164, Inst Elect & Telecommun Rennes, F-35042 Rennes, France
[2] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA
关键词
Off-chip antenna; millimeter-wave; submillimeter-wave; CMOS RFIC; on-chip antenna; transmitter; silicon micromachined antenna; beam-lead interconnection; FLIP-CHIP INTERCONNECTS; WAVE TRANSCEIVERS; ANTENNA; PERFORMANCE; TECHNOLOGY; LENS; GHZ;
D O I
10.1109/TTHZ.2015.2446200
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
One of the main reasons CMOS systems has low overall efficiency is the performance of the on-chip antennas. With the recent severe metal density rules the problem has become more severe. Hence, antenna engineers need to move toward systems-in-package involving off-chip antenna solutions for high-efficiency performance. We introduce a new metal beam-lead interconnection technique which offers better matching control and lower loss at higher frequencies. The metal beam-lead interconnection appears to be a good solution for CMOS circuits at millimeter- and submillimeter-wave frequencies where off-chip connections are required. In this paper, we report performance of a 150 GHz CMOS transmitter which uses metal beam-lead interconnect between a high efficiency silicon antenna and a CMOS transmitter.
引用
收藏
页码:637 / 644
页数:8
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