Fracture study of ultrasonic aluminum wire wedge bonding on copper substrate with mechanical peeling-off method

被引：0

作者：

Bang, Heeseon ^{[1
]}

Ji, Hongjun ^{[2
,3
]}

Li, Mingyu ^{[3
]}

Wang, Chunqing ^{[3
]}

Bang, Han Sur ^{[1
]}

机构：

[1] Chosun Univ, Dept Naval Architecture & Ocean Engn, 375 Seosek Dong, Kwangju 501759, South Korea

[2] Shenzhen Univ, Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen 518055, Peoples R China

[3] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China

来源：

ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY | 2008年 / 580-582卷

关键词：

ultrasonic wedge bonding; ultrasonic vibration; friction; lateral deformation;

D O I：

10.4028/www.scientific.net/MSF.580-582.173

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond Fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

引用

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页码：173 / +

页数：2

共 29 条

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