Chemical interaction and activation phenomena in cold-sprayed Cu particles on Sn substrate

被引：3
|
作者：
Ko, Kyung Hyun [1 ,2 ]
Lee, H. [1 ,2 ]
Jung, Sang-Hyun [3 ]
Ahn, Byungmin [1 ,2 ]
机构：
[1] Ajou Univ, Dept Mat Sci & Engn, Suwon 16499, South Korea
[2] Ajou Univ, Dept Energy Syst Res, Suwon 16499, South Korea
[3] Agcy Def Dev, Res & Dev 4, Daejeon 34060, South Korea
来源：
MATERIALS LETTERS | 2018年 / 215卷
基金：
新加坡国家研究基金会;
关键词：
Cold spray; Cu; Intermixing; Interfaces; Intermetallic compounds; COATINGS; DEPOSITION; MECHANISM; TEMPERATURE;
D O I：
10.1016/j.matlet.2017.12.092
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
For the interactions at the interfaces of cold sprayed particles/substrates, the formation of intermetallic compounds (IMCs) of cold-sprayed Cu particles on a Sn substrate was investigated. Under room-temperature spray conditions, intermetallic layers (Cu6Sn5) were formed at the interfaces because of the high velocity collisions of the Cu particles. For the chemical interaction and activation phenomena, including intermixing at the interfaces, the bonding mechanism of the cold-sprayed coatings involved interlocking of the sprayed particles on the blasted substrates, as well as interactions between the particles and the substrate due to the high-velocity collisions (intermixing -> particles' interaction). (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码：161 / 164
页数：4
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