Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

被引：30

作者：

Harendt, Christine ^{[1
]}

Kostelnik, Jan ^{[2
]}

Kugler, Andreas ^{[3
]}

Lorenz, Enno ^{[3
]}

Saller, Stefan ^{[4
]}

Schreivogel, Alina ^{[2
]}

Yu, Zili ^{[1
]}

Burghartz, Joachim N. ^{[1
]}

机构：

[1] Inst Mikroelekt Stuttgart IMS CHIPS, Stuttgart, Germany

[2] Wurth Elekt GmbH Co KG, Rot Am See, Germany

[3] Robert Bosch GmbH, Waiblingen, Germany

[4] Fest AG & Co KG, Esslingen, Germany

来源：

SOLID-STATE ELECTRONICS | 2015年 / 113卷

关键词：

Ultra-thin chips; Hybrid System-in-Foil; Chip warpage; Mechanical stability; Bending stress measurement; Embedded component technology;

D O I：

10.1016/j.sse.2015.05.023

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：101 / 108

页数：8

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