Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

被引：30
|
作者：
Harendt, Christine [1 ]
Kostelnik, Jan [2 ]
Kugler, Andreas [3 ]
Lorenz, Enno [3 ]
Saller, Stefan [4 ]
Schreivogel, Alina [2 ]
Yu, Zili [1 ]
Burghartz, Joachim N. [1 ]
机构：
[1] Inst Mikroelekt Stuttgart IMS CHIPS, Stuttgart, Germany
[2] Wurth Elekt GmbH Co KG, Rot Am See, Germany
[3] Robert Bosch GmbH, Waiblingen, Germany
[4] Fest AG & Co KG, Esslingen, Germany
来源：
SOLID-STATE ELECTRONICS | 2015年 / 113卷
关键词：
Ultra-thin chips; Hybrid System-in-Foil; Chip warpage; Mechanical stability; Bending stress measurement; Embedded component technology;
D O I：
10.1016/j.sse.2015.05.023
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：101 / 108
页数：8
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