High heat flux thermal management of microfabricated upper millimeter-wave vacuum electronic devices

被引：0
|
作者：
Calame, Jeffrey A. [1 ]
机构：
[1] USN, Res Lab, Washington, DC 20375 USA
来源：
2008 IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE | 2008年
关键词：
microchannel cooler; DRIE; LIGA;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Computations of operating temperatures in microfabricated upper-millimeter-wave sheet beam traveling wave structures are provided. The studies include the effects of different cooling techniques and construction materials. The scaling of output power capability vs. frequency, as constrained by thermal limits, is also presented.
引用
收藏
页码：48 / 49
页数：2
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