Contactless interconnection methods - Capacitively coupled interconnection in mobile devices

被引：0

作者：

Jussila, Aarno ^{[1
]}

Takaneva, Jussi ^{[1
]}

机构：

[1] Nokia Electr Ltd, Devices R&D, Tampere, Finland

来源：

2008 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Contactless interconnection methods are studied as possible alternatives for galvanic interconnection in mobile devices. This is due to ever-increasing requirements for the connector size and bandwidth. Capacitively coupled interconnection is implemented on a PCB level and signal transmission with pulse signaling is demonstrated for 1 MHz, 10 MHz and 40 MHz PRBS signals. Different schemes for signal transmission through a capacitive interconnection are discussed and their potential benefits are evaluated.

引用

页码：6 / 9

页数：4

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