The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

被引：10

作者：

Mutuku, Francis ^{[1
,2
]}

Arfaei, Babak ^{[1
]}

Cotts, Eric J. ^{[1
]}

机构：

[1] SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA

[2] Univ Instruments Corp, Conklin, NY USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2017年 / 46卷 / 04期

基金：

美国国家科学基金会;

关键词：

Microstructure; solidification; alloying elements; shear fatigue; reliability; SN-AG-CU; PRIMARY BETA-SN; COOLING RATE; MICROSTRUCTURAL EVOLUTION; FATIGUE PROPERTIES; BEHAVIOR; GROWTH; CREEP; AG3SN; ALLOYS;

D O I：

10.1007/s11664-016-5130-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The number, and the spacing, of Ag3Sn precipitates in Sn-Ag-Cu/Cu solder joints were related to separate processing parameters. The mechanical properties of an individual solder joint were directly related to the resulting distribution of different dispersoids in the joint. As the number of Ag3Sn precipitates increased, so did solder joint strength and shear fatigue lifetime. The room-temperature shear fatigue lifetime was inversely correlated with the separation between Ag3Sn precipitates. Bi and Sb solid solution strengthening was found to result in significantly larger values of shear strength and shear fatigue lifetime for one Pb-free solder. Room-temperature shear fatigue lifetime tests were identified as a relatively straightforward, yet sensitive means to gain insight into the reliability of Sn-Ag-Cu (SAC) solder joints.

引用

页码：2067 / 2079

页数：13

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