Advanced Non-destructive Fault Isolation using Computed Tomography in Flip-chip devices

被引：0

作者：

Syahirah, Z. ^{[1
]}

Gopinath, R. ^{[1
]}

Tay, M. Y. ^{[1
]}

机构：

[1] Adv Micro Devices Singapore Pte Ltd, Device Anal Lab, Singapore 469032, Singapore

来源：

PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomogaphy (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.

引用

页码：537 / 541

页数：5

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