Advanced Non-destructive Fault Isolation using Computed Tomography in Flip-chip devices

被引：0
|
作者：
Syahirah, Z. [1 ]
Gopinath, R. [1 ]
Tay, M. Y. [1 ]
机构：
[1] Adv Micro Devices Singapore Pte Ltd, Device Anal Lab, Singapore 469032, Singapore
来源：
PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomogaphy (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.
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页码：537 / 541
页数：5
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