PACKAGING TECHNOLOGY FOR EMBEDDED OPTICAL MODULES

被引：0
|
作者：
Ahadian, J. [1 ]
Kusumoto, K. [1 ]
Bachta, P. [1 ]
Wong, M. [1 ]
Pommer, D. [1 ]
Hagan, R. [1 ]
Lenos, H. [1 ]
Kuznia, C. [1 ]
机构：
[1] Ultra Commun Inc, Vista, CA USA
来源：
2013 IEEE OPTICAL INTERCONNECTS CONFERENCE | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：15 / 16
页数：2
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