Thermal and Mechanical Analysis of a Concentrated Photovoltaic Module with Integrated Secondary Optics

The behavior of the thermal and mechanical stresses in CPV modules with integrated secondary optics (SOE) is studied. The aim of this study is to develop a numerical platform for the validation of CPV module designs. The study is based on numerical simulations using the finite elements methods. A comprehensive and complete numerical model is constructed using modeling software and methodologies initially developed to study the reliability of microelectronic components. Thermal analysis results show that most of the heat is dissipated in the downward direction, through the module substrate. This means that attaching the SOE to the solar cell with a layer of material that has a low thermal conductivity (such as silicone) is not harmful to the overall module thermal performances. In addition, the presence of the SOE does not subject the cell to compressive stresses due to the layer of silicone that acts as a stress buffer. The maximum strains are located in the connecting elements (e.g. silicone between SOE and cell and the SOE holder attach). These strains are high (4%), but can be supported by flexible connecting elements like silicone.