Stroboscopic digital speckle pattern interferometry for vibration analysis of microsystem

被引：26

作者：

Yang, L. X. ^{[1
]}

Schuth, M. ^{[2
]}

Thomas, D. ^{[1
]}

Wang, Y. H. ^{[1
,3
]}

Voesing, F. ^{[4
]}

机构：

[1] Oakland Univ, Dept Mech Engn, Rochester, MI 48309 USA

[2] Univ Appl Sci Trier FH Trier, D-54293 Trier, Germany

[3] Hefei Univ Technol, Sch Instrument Sci & Optoelect Engn, Hefei, Peoples R China

[4] OPTOTRON, D-34246 Vellmar, Germany

来源：

OPTICS AND LASERS IN ENGINEERING | 2009年 / 47卷 / 02期

关键词：

Digital speckle pattern interferometry (DSPI); Stroboscopic illumination; Vibration measurement; Microsystem; MEMS;

D O I：

10.1016/j.optlaseng.2008.04.025

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

In this paper, vibration measurement and analysis of microsystems, such as micro-electro-mechanical systems (MEMS) by using stroboscopic digital speckle pattern interferometry (DSPI) is presented. Because of the speckle interferometry, the technique is suited for samples which have a rough surface or whose surfaces can be sprayed into a scattering surface. A laser speckle microinterferometer incorporated with optoelectronic devices for a stroboscopic illumination and a synchronization of the signals between excitation and stroboscopic illumination is described and demonstrated. The system can measure both out-of-plane and in-plane displacement under either a static or dynamic loading. The fundamental is explained and some applications are demonstrated. (c) 2008 Elsevier Ltd. All rights reserved.

引用

页码：252 / 258

页数：7

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