Stroboscopic digital speckle pattern interferometry for vibration analysis of microsystem

被引：26
|
作者：
Yang, L. X. [1 ]
Schuth, M. [2 ]
Thomas, D. [1 ]
Wang, Y. H. [1 ,3 ]
Voesing, F. [4 ]
机构：
[1] Oakland Univ, Dept Mech Engn, Rochester, MI 48309 USA
[2] Univ Appl Sci Trier FH Trier, D-54293 Trier, Germany
[3] Hefei Univ Technol, Sch Instrument Sci & Optoelect Engn, Hefei, Peoples R China
[4] OPTOTRON, D-34246 Vellmar, Germany
来源：
OPTICS AND LASERS IN ENGINEERING | 2009年 / 47卷 / 02期
关键词：
Digital speckle pattern interferometry (DSPI); Stroboscopic illumination; Vibration measurement; Microsystem; MEMS;
D O I：
10.1016/j.optlaseng.2008.04.025
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
In this paper, vibration measurement and analysis of microsystems, such as micro-electro-mechanical systems (MEMS) by using stroboscopic digital speckle pattern interferometry (DSPI) is presented. Because of the speckle interferometry, the technique is suited for samples which have a rough surface or whose surfaces can be sprayed into a scattering surface. A laser speckle microinterferometer incorporated with optoelectronic devices for a stroboscopic illumination and a synchronization of the signals between excitation and stroboscopic illumination is described and demonstrated. The system can measure both out-of-plane and in-plane displacement under either a static or dynamic loading. The fundamental is explained and some applications are demonstrated. (c) 2008 Elsevier Ltd. All rights reserved.
引用
收藏
页码：252 / 258
页数：7
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