Investigation of filler effect on treeing phenomenon in epoxy resin under ac voltage

被引:24
|
作者
Kurnianto, Rudi [1 ]
Murakami, Yoshinobu [1 ,3 ,4 ]
Nagao, Masayuki [1 ]
Hozumi, Naohiro [2 ]
机构
[1] Toyohashi Univ Technol, Dept Elect & Informat Engn, Toyohashi, Aichi 4418580, Japan
[2] Aichi Inst Technol, Dept Elect Engn, Toyota 4700392, Japan
[3] Nagano Coll Technol, Dept Elect Engn, Nagano, Japan
[4] Toyohashi Univ Technol, Dept Elect & Elect Engn, Toyohashi, Aichi 4418580, Japan
关键词
epoxy resin; filler; treeing; silane coupling treatment; release agent; adhesion property; moisture;
D O I
10.1109/TDEI.2008.4591234
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Epoxy resin is widely used as an insulation material in many electrical apparatuses because of its excellent electrical and manufacture characteristics. It is usually mixed with filler to improve mechanical and thermal characteristics. In order to qualitatively clarify the effect of fillers on treeing phenomena, treeing tests were performed with epoxy specimens mixed with different kinds of fillers. The property of the interface is also clarified by the treatment of silica filler using silane coupling. Although tree initiation voltage decreased with introducing silica fillers, the fillers prevented the growth of the tree. The effect of filler shape was more significant on round-shape filler than on square-shape filler. Silane coupling treatment to the fillers did not bring a significant change in tree initiation voltage, however, brought a reduction in tree propagation. The change in tree propagation rate was explained by considering the field relaxation and energy dispersion due to branching at the filler-resin interface. Tree propagation along the interface between resin and a quartz plate was observed and analyzed in order to ensure the above explanation.
引用
收藏
页码:1112 / 1119
页数:8
相关论文
共 50 条
  • [31] Effect of Boron Carbide Filler on the Curing and Mechanical Properties of an Epoxy Resin
    Abenojar, J.
    Martinez, M. A.
    Velasco, F.
    Pascual-Sanchez, V.
    Martin-Martinez, J. M.
    JOURNAL OF ADHESION, 2009, 85 (4-5): : 216 - 238
  • [33] Influence of Space Charge under Non-uniform Electric Field to Electrical Treeing in Epoxy Resin
    Fujii, Masayuki
    Shimose, Hiroyuki
    Fukuma, Masumi
    Takao, Toru
    Nagao, Masayuki
    PROCEEDINGS OF 2011 INTERNATIONAL CONFERENCE ON ELECTRICAL INSULATING MATERIALS (ISEIM), 2011, : 58 - 61
  • [34] Space charge measurements in epoxy resin under DC voltage
    Guillermin, C
    Rain, P
    Sylvestre, A
    Rowe, S
    2002 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, 2002, : 606 - 609
  • [35] Effect of Aging Time on the Growth Characteristics of Electrical Treeing in Epoxy Resin-Impregnated Paper
    Wang, Yongqiang
    Huang, Ziye
    Gao, Meng
    Shang, Jing
    Wang, Ziqi
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2022, 29 (05) : 1923 - 1930
  • [36] INFLUENCE OF SPACE-CHARGE BUILDUP ON THE TRANSITION TO ELECTRICAL TREEING IN PE UNDER AC VOLTAGE
    MAMMERI, M
    LAURENT, C
    SALON, J
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 1995, 2 (01) : 27 - 35
  • [37] Electroluminescence of Epoxy Resin Nanocomposite under AC High Field II
    Masuda, Shumpei
    Tohyama, Kazuyuki
    Iizuka, Tomonori
    Tatsumi, Kohei
    Yoshida, Shigeyoshi
    Umemoto, Takahiro
    Mabuchi, Takahiro
    Muto, Hirotaka
    2020 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (2020 IEEE CEIDP), 2020, : 83 - 86
  • [38] Effect of Temperature on Partial Discharge and Breakdown Characteristics of Epoxy Resin Under Square Wave Voltage
    Shang X.
    Pang L.
    Bu Q.
    Zhang Q.
    Gaodianya Jishu/High Voltage Engineering, 2023, 49 (08): : 3286 - 3295
  • [39] Effects of AC and Pulse Voltage Combination on Surface Charge Accumulation and Decay of Epoxy Resin
    Du, B. X.
    Li, Ang
    Li, Jin
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2016, 23 (04) : 2368 - 2376
  • [40] Diluent filler particle size effect for thermal stability of epoxy type resin
    Lee, Seung Bum
    Lee, Hyung Jin
    Hong, In Kwon
    JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, 2012, 18 (02) : 635 - 641