Investigation of filler effect on treeing phenomenon in epoxy resin under ac voltage

被引:24
|
作者
Kurnianto, Rudi [1 ]
Murakami, Yoshinobu [1 ,3 ,4 ]
Nagao, Masayuki [1 ]
Hozumi, Naohiro [2 ]
机构
[1] Toyohashi Univ Technol, Dept Elect & Informat Engn, Toyohashi, Aichi 4418580, Japan
[2] Aichi Inst Technol, Dept Elect Engn, Toyota 4700392, Japan
[3] Nagano Coll Technol, Dept Elect Engn, Nagano, Japan
[4] Toyohashi Univ Technol, Dept Elect & Elect Engn, Toyohashi, Aichi 4418580, Japan
关键词
epoxy resin; filler; treeing; silane coupling treatment; release agent; adhesion property; moisture;
D O I
10.1109/TDEI.2008.4591234
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Epoxy resin is widely used as an insulation material in many electrical apparatuses because of its excellent electrical and manufacture characteristics. It is usually mixed with filler to improve mechanical and thermal characteristics. In order to qualitatively clarify the effect of fillers on treeing phenomena, treeing tests were performed with epoxy specimens mixed with different kinds of fillers. The property of the interface is also clarified by the treatment of silica filler using silane coupling. Although tree initiation voltage decreased with introducing silica fillers, the fillers prevented the growth of the tree. The effect of filler shape was more significant on round-shape filler than on square-shape filler. Silane coupling treatment to the fillers did not bring a significant change in tree initiation voltage, however, brought a reduction in tree propagation. The change in tree propagation rate was explained by considering the field relaxation and energy dispersion due to branching at the filler-resin interface. Tree propagation along the interface between resin and a quartz plate was observed and analyzed in order to ensure the above explanation.
引用
收藏
页码:1112 / 1119
页数:8
相关论文
共 50 条
  • [1] Effect of moisture on treeing phenomenon in epoxy resin with filler under ac voltage
    Nagao, M
    Oda, K
    Nishioka, K
    Muramoto, Y
    Hozumi, N
    2002 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, 2002, : 951 - 954
  • [2] Effect of nano-fillers on electrical treeing in epoxy resin subjected to AC voltage
    Ding, HZ
    Varlow, BR
    2004 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, 2004, : 332 - 335
  • [3] Electrical treeing in epoxy resin: Experimental investigation and simulation
    Sack, M
    Schwab, AJ
    Noskov, MD
    Malinovski, AS
    2000 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS. I & II, 2000, : 313 - 316
  • [4] Treeing breakdown voltage and TSC of alumina filled epoxy resin
    Fujita, S
    Ruike, M
    Baba, M
    IEEE 1996 ANNUAL REPORT - CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS I & II, 1996, : 738 - 741
  • [5] TREEING PHENOMENON IN POLYETHYLENE UNDER HIGH FREQUENCY VOLTAGE
    Nie, Q.
    Zhou, Y. X.
    Xing, X. L.
    Wang, Y. N.
    Wang, Y. S.
    PROCEEDINGS OF THE 6TH INTERNATIONAL CONFERENCE ON APPLIED ELECTROSTATICS, 2008, : 192 - 195
  • [6] Effect of Insulating Gases on Electrical Treeing in Epoxy Resin
    Han, Qinghua
    Iddrissu, Ibrahim
    Chen, Lujia
    Rowland, Simon
    2021 96TH IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (CEIDP 2021) / 16TH IEEE NANOTECHNOLOGY MATERIALS AND DEVICES CONFERENCE (IEEE NMDC 2021), 2021, : 482 - 485
  • [7] On investigation of PD aging of epoxy resin under distorted voltage
    del Casale, MD
    Romano, P
    Schifani, R
    2000 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS. I & II, 2000, : 573 - 576
  • [8] Unveiling frequency dependence of electrical treeing degradation in epoxy resin under bipolar square wave voltage
    Zhang, Chuang
    Xiang, Jiao
    Ruan, Yang
    Cui, Huize
    Wang, Shihang
    Li, Jianying
    Li, Shengtao
    JOURNAL OF APPLIED PHYSICS, 2024, 136 (22)
  • [9] Electrical tree characteristics of epoxy resin under AC voltage at 77 K
    Wang, Yongguang
    Huang, Rongjin
    Li, Chuanyang
    Zhang, Chi
    Shen, Fuzhi
    Li, Jian
    Dong, Hongyu
    Zhang, Hua
    Zhang, Hengcheng
    Li, Laifeng
    CRYOGENICS, 2019, 99 : 123 - 129
  • [10] Optimization of Epoxy Resin: An Investigation of Eggshell as a Synergic Filler
    de Lima Souza, Jose William
    Jaques, Nichollas Guimaraes
    Popp, Matthias
    Kolbe, Jana
    Lia Fook, Marcus Vinicius
    Ramos Wellen, Renate Maria
    MATERIALS, 2019, 12 (09)