Thermal Cycling Fatigue Analysis of Copper Pillar-to-Solder Joint Reliability

被引：3
|
作者：
Pang, John H. L. [1 ]
Wong, Stephen C. K. [2 ]
Neo, Sai Kiat [1 ]
Tan, Kok Ee [1 ]
机构：
[1] Nanyang Technol Univ, Sch Mech & Aerosp Engn, 50 Nanyang Ave, Singapore 639798, Singapore
[2] SIMTech, Singapore 638075, Singapore
来源：
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2008年
关键词：
copper pillar; pin-head interconnect; solder joint reliability; thermal cycling fatigue; CTE mismatch;
D O I：
10.1109/ESTC.2008.4684443
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper evaluates two novel copper pin-head pillar interconnection structures with solder joints suitable for fine-pitch, low stand-off height interconnection for flip chip technology. Current flip chip interconnection requires underfill encapsulation to meet the requirements in thermal cycling fatigue test. An alternative to underfill encapsulation for improving solder joint reliability is to implement copper pillar-to-solder joint assembly. Such a copper pillar solder joint method is designed to meet the solder joint reliability requirements of 500 cycles suitable for telecom and portable electronic products. Parametric studies were conducted using finite element analysis to investigate the effects of different copper pillar-to-solder joint geometries on the solder fatigue performance.
引用
收藏
页码：743 / +
页数：2
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