The Effect of Humidity on Reducing Forming Voltage in Conductive-Bridge Random Access Memory With an Alloy Electrode

被引:2
|
作者
Lin, Shih-Kai [1 ]
Chen, Min-Chen [2 ]
Chang, Ting-Chang [2 ]
Lien, Chen-Hsin [1 ]
Chang, Jing-Shuen [1 ]
Wu, Cheng-Hsien [3 ]
Tseng, Yi-Ting [2 ]
Xu, You-Lin [3 ]
Huang, Kai-Lin [3 ]
Sun, Li-Chuan [3 ]
Zhang, Yong-Ci [3 ]
Chiu, Yu-Ju [2 ]
Sze, Simon M. [4 ]
机构
[1] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 30013, Taiwan
[2] Sun Yat Sen Univ, Dept Phys, Kaohsiung 80424, Taiwan
[3] Natl Sun Yat Sen Univ, Dept Mat & Optoelect Sci, Kaohsiung 80424, Taiwan
[4] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30013, Taiwan
关键词
CBRAM; alloy electrode; galvanic reaction; humidity; CORROSION; DEVICE;
D O I
10.1109/LED.2019.2935542
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter investigates Au30Ag70 (alloy electrode)/SiO2/TiN conductive-bridge random access memory (CBRAM) to verify the influence of ambient conditions on forming voltage (V-F) and the location of galvanic reaction. Previous literature demonstrates that the galvanic reaction in CBRAM with an alloy electrode results in a lower V-F. In this work, a higher environmental H2O concentration results in a decrease in V-F. From this change in VF, we infer that environmental H2O concentration influences the amount of galvanic reaction. Moreover, we verify the location of the galvanic reaction by varying electrode thickness. Finally, we propose a physical model to explain our observations.
引用
收藏
页码:1606 / 1609
页数:4
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