Burn-in Screening Technology of Power Bare Die

被引：0
|
作者：
Huang Yun [1 ]
Yang Shaohua [1 ]
En Yunfei [1 ]
Feng Yongjie [1 ]
机构：
[1] China Elect Produce Reliabil & Environm Testing R, Natl Key Lab Sci & Technol Reliabil Phys & Applic, Guangzhou, Guangdong, Peoples R China
来源：
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词：
D O I：
10.1109/ICEPT.2010.5582780
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
his paper focuses on the Burn-in Screening Technology of Power Bare Die. A temporary carrier that allows the power bare die full temperature testing and burn-in has been described. A suitable improvement multi-bump contact carrier technology has been put forward and Experiment results have shown that the contact resistance of the new carrier decrease 40% significantly. Base on the peak value junction temperature controlling, A more effective power bare die pulse full power burn-in screening technology have been proposed, which power bare dies would be burn-in screened by 100%. So the high quality and reliability requirements for bare power die of MCM and SiP are met..
引用
收藏
页码：1255 / 1258
页数：4
相关论文
共 50 条
  • [1] PRODUCTION SYSTEM FACILITATES BARE-DIE TEST AND BURN-IN
    MALINIAK, D
    [J]. ELECTRONIC DESIGN, 1994, 42 (17) : 36 - +
  • [2] Design for Burn-In Test: A Technique for Burn-In Thermal Stability under Die-to-Die Parameter Variations
    Meterelliyoz, Mesut
    Roy, Kaushik
    [J]. PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009, 2009, : 787 - 792
  • [3] BURN-IN POWER-SUPPLIES
    SCHULZ, RF
    [J]. ELECTRONIC PRODUCTS MAGAZINE, 1983, 26 (09): : 103 - 106
  • [4] To Burn-In, or Not to Burn-In: That's the Question
    Suhir, Ephraim
    [J]. AEROSPACE, 2019, 6 (03)
  • [5] Burn-in, burn-in: dc inferno
    Breed, Paul
    [J]. EDN, 2009, 54 (24) : 56 - 56
  • [6] Burn-in for high-power devices
    Hamilton, H
    Urbanek, J
    [J]. EE-EVALUATION ENGINEERING, 2006, 45 (03): : 40 - 43
  • [7] Burn-in
    Block, HW
    Savits, TH
    [J]. STATISTICAL SCIENCE, 1997, 12 (01) : 1 - 13
  • [8] The challenges of high-power burn-in with test
    Hamilton, H
    Urbanek, J
    [J]. EE-EVALUATION ENGINEERING, 2002, 41 (12): : 30 - +
  • [9] Keeping power supply burn-in cool and green
    Sugrue, E
    Sjodin, K
    [J]. EE-EVALUATION ENGINEERING, 1997, 36 (03): : 42 - &
  • [10] POWER DISSIPATION IN A DIODE IN A COMMON BURN-IN CIRCUIT
    ROOT, CD
    CARELIS, C
    [J]. MICROELECTRONICS RELIABILITY, 1967, 6 (02) : 189 - &
12345