Some aspects of copper corrosion in presence of benzotriazole and chloride ions

被引:108
|
作者
Milic, S. M. [1 ]
Antonijevic, M. M. [1 ]
机构
[1] Univ Belgrade, Tech Fac Bar, Bor 19210, Serbia
关键词
Copper; Cyclic voltammetry; Electrochemical behaviour; Benzotriazole; Chloride ion; ELECTROCHEMICAL-BEHAVIOR; ELECTRODE BEHAVIOR; PITTING CORROSION; BUFFER SOLUTIONS; ALKYL ESTERS; SCHIFF-BASES; INHIBITION; ACID; FILMS; BRASS;
D O I
10.1016/j.corsci.2008.10.007
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper deals with the investigation of electrochemical behaviour of copper in a sodium tetraborate (borax) solution in the presence and absence of chloride ions. The influence of benzotriazole (BTA) on the anodic behaviour of copper was also investigated. it was found that Cu2O and CuO oxides were formed on copper and that peak current moved to the positive side with increased immersion time in a sodium tetraborate solution. After 1 h immersion of the copper electrode in a sodium tetraborate solution containing various chloride ion concentrations (0.001, 0.010, 0.050, and 0.100 mol/dm(3) Cl-) the activation effect of those ions was found, whereas after 6 h immersion of copper in the above mentioned solutions, chloride ions were found to have not only activation but also passivation effect. The investigation of the effect of benzotriazole led to a conclusion that BTA has an inhibiting effect with increasing immersion times (15 min, 1 h, 4 h, and 48 h) as well as with increasing BTA concentrations (8.4 x 10(-6), 8.4 x 10(-5), 8.4 x 10(-4), and 8.4 x 10(-3) mol/dm(3)). In addition, at the lowest investigated BTA concentration (8.4 x 10(-7) mol/dm(3)) an activation effect of this compound on copper dissolution was observed. Based on the Langmuir adsorption isotherm, the value of the standard free energy adsorption was found to be Delta G(0) = -35.4 kJ/mol. (c) 2008 Elsevier Ltd. All rights reserved.
引用
下载
收藏
页码:28 / 34
页数:7
相关论文
共 50 条
  • [31] Effect of Chloride and Copper Ions on Corrosion of 5182 Aluminum Alloy
    Soares, Beatriz M. C.
    Ocanha, Ana Carolina S.
    Dantas, Silvia T.
    Anjos, Carlos A. R.
    18TH IAPRI WORLD PACKAGING CONFERENCE, 2012, : 500 - 507
  • [32] Roles of Chloride Ions in the Formation of Corrosion Protective Films on Copper
    Kozlica, Dzevad K.
    Ekar, Jernej
    Kovac, Janez
    Milosev, Ingrid
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2021, 168 (03)
  • [33] ROLE OF CHLORIDE-IONS IN RELATION TO COPPER CORROSION AND INHIBITION
    MAYANNA, SM
    SETTY, THV
    PROCEEDINGS OF THE INDIAN ACADEMY OF SCIENCES SECTION A, 1974, 80 (04): : 184 - 193
  • [34] Effect of hydrodynamic conditions on copper pitting corrosion inhibition in hydrocarbonate-chloride solutions by benzotriazole
    Skrypnikova, E. A.
    Kaluzhina, S. A.
    INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION, 2015, 4 (02): : 139 - 145
  • [35] The Influence of pH on Electrochemical Behavior of Copper in Presence of Chloride Ions
    Antonijevic, M. M.
    Alagic, S. C.
    Petrovic, M. B.
    Radovanovic, M. B.
    Stamenkovic, A. T.
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2009, 4 (04): : 516 - 524
  • [36] Thermoacidophilic bioleaching of copper sulfide concentrate in the presence of chloride ions
    Bakhshoude, Mahboube
    Darezereshki, Esmaeel
    Bakhtiari, Fereshteh
    JOURNAL OF CENTRAL SOUTH UNIVERSITY, 2023, 30 (03) : 749 - 762
  • [37] Anodic behavior of copper in chloride/tolytriazole and chloride/benzotriazole solutions
    Tromans, D
    Silva, JC
    CORROSION, 1997, 53 (01) : 16 - 25
  • [38] Adsorption Dynamics of Benzotriazole on Copper in Chloride Solution
    Chen, Y.
    Jiang, Y. Y.
    Ye, Z. Y.
    Zhang, Z.
    CORROSION, 2013, 69 (09) : 886 - 892
  • [39] SOME CHEMICAL ASPECTS OF THE CORROSION INHIBITION OF COPPER BY BENZTRIAZOLE
    FOX, PG
    LEWIS, G
    BODEN, PJ
    CORROSION SCIENCE, 1979, 19 (07) : 457 - 467
  • [40] The effect of oxygen on the inhibition of copper corrosion with benzotriazole
    Mansikkamäki, K
    Johans, C
    Kontturi, K
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (01) : B22 - B24