Silicon-on-diamond - An engineered substrate for electronic applications

被引:34
|
作者
Aleksov, A [1 ]
Gobien, JM [1 ]
Li, X [1 ]
Prater, JT [1 ]
Sitar, Z [1 ]
机构
[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
关键词
silicon-on-diamond (SOD); devices; electronic properties; thermal properties;
D O I
10.1016/j.diamond.2005.09.012
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Silicon on Diamond (SOD) is a substrate engineered to address the major challenges of silicon-based ULSI technology, in particular, to provide for enhanced thermal management and charge confinement. The SOD concept is achieved by joining a thin, single crystalline Si device layer to a highly oriented diamond (HOD) layer that serves as an electrical insulator, heat spreader and supporting substrate. Therefore, SOD represents an alternative SOI concept, where the thermally insulating SiO2 has been replaced by highly thermally conductive diamond. Initial experiments and theoretical assessments have been aimed at demonstrating the improved thermal management properties of fabricated SOD wafers and comparing them to Si and SOI [A. Aleksov, X Li, N. Govindaraju, J.M. Gobien, S.D. Wolter, J.T. Prater, Z. Sitar, Silicon on Diamond: an advanced Silicon on Insulator technology, Diamond and Related Materials, 14, 308-313 (2005)], [A. Aleksov, S.D. Wolter, JT. Prater, Z. Sitar, Fabrication and Thermal Evaluation of Silicon on Diamond Wafers, Journal of Electronic Materials, 34 (2005) 1089.]. The experimental results are in good agreement with the values obtained by finite element modeling (FEM). The results show that for a 1.5 mu m thick Si device layer, SOD can sustain more than 10 times higher power than SOL This in turn will permit a more than 3-fold greater integration density of circuits fabricated oil SOD as compared to SOL Having validated the superior thermal management properties of SOD, the second task has been to compare device operation on SOD and SOI to identify whether the Si layer degrades during the SOD fabrication process. In addition, the analysis of the interface properties between the Si device layer and diamond is important in order to better understand the operation of devices on SOD and identify their limitations. For this reason, Schottky and pn-junction diodes were fabricated oil the Si device layer of SOD and SOI wafers. The first results of the electrical analyses indicated that there are no additional leakage currents in SOD devices compared to devices on SOL In addition, CV measurements indicated no differences in the device behavior i.e. no additional charge trapping with respect to SOI in the frequency range of 1 kHz-10 MHz. (c) 2005 Elsevier B.V All rights reserved.
引用
收藏
页码:248 / 253
页数:6
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