Silicon-silicon anodic-bonding with intermediate glass layers using spin-on glasses

被引：15
|
作者：
Quenzer, HJ [1 ]
Dell, C [1 ]
Wagner, B [1 ]
机构：
[1] FRAUNHOFER INST SILIZIUMTECHNOL,D-14199 BERLIN,GERMANY
来源：
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS | 1996年
关键词：
D O I：
10.1109/MEMSYS.1996.493993
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：272 / 276
页数：5
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