Rapid Fabrication of Poly(methyl methacrylate) Devices for Lab-on-a-Chip Applications Using Acetic Acid and UV Treatment

被引:42
|
作者
Trinh, Kieu The Loan [2 ]
Thai, Duc Anh [1 ]
Chae, Woo Ri [3 ]
Lee, Nae Yoon [1 ]
机构
[1] Gachon Univ, Dept BioNano Technol, Seongnam Si 13120, Gyeonggi Do, South Korea
[2] Gachon Univ, Dept Ind Environm Engn, Seongnam Si 13120, Gyeonggi Do, South Korea
[3] Gachon Univ, BioNano Res Inst, Seongnam Si 13120, Gyeonggi Do, South Korea
来源
ACS OMEGA | 2020年 / 5卷 / 28期
基金
新加坡国家研究基金会;
关键词
POLYMERASE-CHAIN-REACTION; BONDING METHOD; SOLVENT; MICROELECTRODES; TEMPERATURE; MICRODEVICE; BIOSENSOR; RESPONSES;
D O I
10.1021/acsomega.0c01770
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In the present study, we introduce a new approach for rapid bonding of poly(methyl methacrylate) (PMMA)-based microdevices using an acetic acid solvent with the assistance of UV irradiation. For the anticipated mechanism, acetic acid and UV irradiation induced free radicals on the PMMA surfaces, and acrylate monomers subsequently formed cross-links to create a permanent bonding between the PMMA substrates. PMMA devices effectively bonded within 30 s at a low pressure using clamps, and a clogging-free microchannel was achieved with the optimized 50% acetic acid. For surface characterizations, contact angle measurements and bonding performance analyses were conducted using predetermined acetic acid concentrations to optimize bonding conditions. In addition, the highest bond strength of bonded PMMA was approximately 11.75 MPa, which has not been reported before in the bonding of PMMA. A leak test was performed over 180 h to assess the robustness of the proposed method. Moreover, to promote the applicability of this bonding method, we tested two kinds of microfluidic device applications, including a cell culture-based device and a metal microelectrode-integrated device. The results showed that the cell culture-based application was highly biocompatible with the PMIVIA microdevices fabricated using an acetic acid solvent. Moreover, the low pressure required during the bonding process supported the integration of metal microelectrodes with the PMMA microdevice without any damage to the metal films. This novel bonding method holds great potential in the ecofriendly and rapid fabrication of microfluidic devices using PMMA.
引用
收藏
页码:17396 / 17404
页数:9
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