Experimental and numerical analysis on the adhesive T-joint using high temperature adhesive

被引:0
|
作者
Bahri, N. F. [1 ]
Afendi, M. [1 ]
Razlan, Z. M. [1 ]
Zunaidi, I. [1 ]
Wan, W. K. [1 ]
Shahriman, A. B. [1 ]
机构
[1] Univ Malaysia Perlis, Sch Mechatron Engn, Pauh Putra Campus, Arau 02600, Perlis, Malaysia
关键词
T-joint; temperature; adhesive thickness; finite element prediction;
D O I
10.1088/1757-899X/429/1/012093
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The adhesive T-joint is most widely used in automotive, aircraft and fluidization bed system. In order to determine the effect of the temperature and adhesive thickness on the joint strength, a series of a tensile test and numerical analysis were conducted in this study. The T-joint specimens were fabricated using 304 stainless steel plate (SS 304), 304 stainless steel perforated plate and high-temperature epoxy adhesive. The series of adhesive T-joints with different adhesive thicknesses (0.5, 1.0, 1.5 and 2.0 mm) were tested in tension loading at room temperature (RT) and elevated temperature (55 degrees C, 75 degrees C, 100 degrees C and 125 degrees C). Additionally, the T-joint structure was modelled, simulated and analysed for stress assessment to predict the strength of adhesive T-joint at the various temperature and adhesive thicknesses. The average failure stress decreases with the increasing of the temperature. Nevertheless, the failure stress of the T-joint decreased with the increasing of the adhesive thickness. The finite element prediction for T-joint strength is in a good agreement with the experimental failure stress results.
引用
收藏
页数:5
相关论文
共 50 条
  • [31] Tapered and parallel adhesive joints. Numerical and experimental analysis
    Buchman, A.
    Holdengraber, Y.
    Dodiuk, H.
    Polymer Preprints, Division of Polymer Chemistry, American Chemical Society, 1993, 34 (02):
  • [32] Numerical Simulation of Temperature Field and Residual Stresses in Stainless Steel T-Joint
    Chen, Quan
    Fei, Fan
    Yu, Shidi
    Liu, Chunjing
    Tang, Jiahui
    Yang, Xu
    TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 2020, 73 (03) : 751 - 761
  • [33] Numerical Analysis on the Temperature and Thermal Stress Distribution in Adhesive Joints
    Zhao, Ning
    Cao, Leilei
    Guo, Hui
    Jia, Qingjian
    Dai, Jianjing
    ADVANCED DESIGN AND MANUFACTURE TO GAIN A COMPETITIVE EDGE: NEW MANUFACTURING TECHNIQUES AND THEIR ROLE IN IMPROVING ENTERPRISE PERFORMANCE, 2008, : 71 - +
  • [34] Vibration analysis of single lap adhesive joint with non-uniform adhesive thickness: Experimental and analytical investigation
    Li, Weidong
    Gu, Jinxiang
    Hu, Ping
    Wu, Kunyue
    MATERIALS PROCESSING TECHNOLOGY, PTS 1-3, 2012, 418-420 : 1312 - 1319
  • [35] Numerical analysis of the influence on high humidity in a T-joint fillet weld for high strength low alloy steel
    Chen, Songping
    Li, Yongxian
    Xie, Yanji
    MATERIAL SCIENCE, CIVIL ENGINEERING AND ARCHITECTURE SCIENCE, MECHANICAL ENGINEERING AND MANUFACTURING TECHNOLOGY II, 2014, 651-653 : 56 - +
  • [36] Conductive adhesive joint for extreme temperature applications
    Jullien, J. B.
    Fremont, H.
    Deletage, J. Y.
    MICROELECTRONICS RELIABILITY, 2013, 53 (9-11) : 1597 - 1601
  • [37] Vibration analysis of single lap adhesive joint: Experimental and analytical investigation
    Ingole, Sanjay B.
    Chatterjee, Animesh
    JOURNAL OF VIBRATION AND CONTROL, 2011, 17 (10) : 1547 - 1556
  • [38] ELASTOPLASTIC ANALYSIS OF ADHESIVE BONDED JOINT
    PRADHAN, SC
    IYENGAR, NGR
    KISHORE, NN
    MECHANICS RESEARCH COMMUNICATIONS, 1993, 20 (02) : 155 - 163
  • [39] VISCOELASTIC ANALYSIS OF AN ADHESIVE TUBULAR JOINT
    ALWAR, RS
    NAGARAJA, YR
    JOURNAL OF ADHESION, 1976, 8 (01): : 79 - 92
  • [40] Experimental and numerical investigations of mixed mode crack growth resistance of a ductile adhesive joint
    Madhusudhana, KS
    Narasimhan, R
    ENGINEERING FRACTURE MECHANICS, 2002, 69 (07) : 865 - 883