Conductivity improvement of silver flakes filled electrical conductive adhesives via introducing silver-graphene nanocomposites

被引:33
|
作者
Peng, Xiao [1 ]
Tan, Fatang [1 ]
Wang, Wei [1 ]
Qiu, Xiaolin [2 ]
Sun, Fazhe [1 ]
Qiao, Xueliang [1 ]
Chen, Jianguo [1 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Plast Forming Simulat & Die & Mold, Wuhan 430074, Hubei, Peoples R China
[2] Nanchang Inst Technol, Nanomat Res Ctr, Nanchang 330013, Jiangxi, Peoples R China
关键词
PERFORMANCE; RELIABILITY; NANOPARTICLES; RESISTIVITY; ELECTRONICS; PASTE;
D O I
10.1007/s10854-013-1671-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, silver-graphene nanocomposites (SGNs) were successfully prepared by spontaneous reduction of silver ions and graphene oxide. Silver nanoparticles (about 30 nm) with narrow size distribution were distributed randomly on the surface of graphene. Different amounts of SGNs were introduced into silver flakes filled electrical conductive adhesives (ECAs) to study the effect of SGNs on the properties of the ECAs. The results showed that the volume resistivity of the ECAs decreased first and then increased with the increase of weight ratios of SGNs to silver flakes. While the weight ratio of SGNs to silver flakes was 20:80 (%), the resistivity reached the lowest value of 2.37 x 10(-4) Omega cm. The lap shear strength decreased with the increase of the content ration of SGNs. And when the weight ratio of SGNs to silver flakes was 20:80 (%), the lap shear strength of ECA was about 10 MPa. According to the thermogravimetric analysis, the addition of SGNs can cause a slight decrease in the thermal stability of the ECA. In summary, SGNs are the promising candidates for the conductivity improvement of silver flakes filled electrical conductive adhesives.
引用
收藏
页码:1149 / 1155
页数:7
相关论文
共 50 条
  • [31] A comprehensive study of silver nanowires filled electrically conductive adhesives
    Y. H. Wang
    N. N. Xiong
    Z. L. Li
    H. Xie
    J. Z. Liu
    J. Dong
    J. Z. Li
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 7927 - 7935
  • [32] New insights into silver nanowires filled electrically conductive adhesives
    Y. H. Wang
    N. N. Xiong
    H. Xie
    Y. Z. Zhao
    Jingze Li
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 621 - 629
  • [33] Stretchable conductive adhesives based on silver/silicone rubber nanocomposites
    Miju, Jung
    Kim, Heesuk
    Huh, Wansoo
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2017, 254
  • [34] Hydrothermal Fabrication of Silver Nanowires-Silver Nanoparticles-Graphene Nanosheets Composites in Enhancing Electrical Conductive Performance of Electrically Conductive Adhesives
    Ma, Hongru
    Zeng, Jinfeng
    Harrington, Steven
    Ma, Lei
    Ma, Mingze
    Guo, Xuhong
    Ma, Yanqing
    NANOMATERIALS, 2016, 6 (06):
  • [35] THERMAL-CONDUCTIVITY OF EPOXY ADHESIVES FILLED WITH SILVER PARTICLES
    BJORNEKLETT, A
    HALBO, L
    KRISTIANSEN, H
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1992, 12 (02) : 99 - 104
  • [36] Calixarene Assisted Rapid Synthesis of Silver-Graphene Nanocomposites with Enhanced Antibacterial Activity
    Kellici, Suela
    Acord, John
    Vaughn, Arni
    Power, Nicholas P.
    Morgan, David J.
    Heil, Tobias
    Facq, Sebastien P.
    Lampronti, Giulio I.
    ACS APPLIED MATERIALS & INTERFACES, 2016, 8 (29) : 19038 - 19046
  • [37] Study of Silver-graphene Tungsten Material For Low VOltage Electrical Contact
    Chen, Hai
    Wang, Pengpeng
    Hernandez, Jesus
    PROCEEDINGS OF THE 2019 65TH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS (ELECTRICAL CONTACTS-2019), 2019, : 142 - 148
  • [38] The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives
    Fan, Qiong
    Cui, Huiwang
    Fu, Chune
    Li, Dongsheng
    Tang, Xin
    Yuan, Zhichao
    Ye, Lilei
    Liu, Johan
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 811 - 816
  • [39] Effect of Treated Silver Nanoparticles to Electrical Conductivity Improvement of Electrically Conductive Adhesive (ECA)
    Kornain, Zainudin
    Amin, Nowshad
    Jalar, Azman
    Cheah, Ang Ye
    Ahmad, Ibrahim
    ICSE: 2008 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS, 2008, : 549 - +
  • [40] Effect of Silver Flakes and Particle Shape on the Steady Shear Viscosity of Isotropic Conductive Adhesives
    Durairaj, R.
    Leong, Kau Chee
    JOURNAL OF TESTING AND EVALUATION, 2015, 43 (06) : 1288 - 1295