Hybrid detector technology applied to digital mammography

被引：0
|
作者：
Roehrig, H [1 ]
Gaalema, S [1 ]
Sharma, SRD [1 ]
Yorke, WE [1 ]
机构：
[1] Univ Arizona, Dept Radiol, Tucson, AZ 85724 USA
来源：
PROCEEDINGS OF THE 19TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOL 19, PTS 1-6: MAGNIFICENT MILESTONES AND EMERGING OPPORTUNITIES IN MEDICAL ENGINEERING | 1997年 / 19卷
关键词：
digital mammography; hybrid detector; indium bump bondin; silicon x-detection;
D O I：
暂无
中图分类号：
R318 [生物医学工程];
学科分类号：
0831 ;
摘要：
Hybrid detector technology based on indium metal bump-bonding techniques is under consideration for x-ray detection at x-ray energies of about 19.5 keV. Silicon of about 1 mm thickness forms the actual detector, converting x-rays directly into electrons (rather than generating light and converting light to photo-electrons). Time-delay-integration increases the sensitivity. Initial results demonstrate that a system based on this technology is useful as scanning x-ray detector for digital mammography and can meet and even exceed the performance of the conventional film/screen system.
引用
收藏
页码：731 / 734
页数：4
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