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- [11] An etch back technique to achieve sub-micron T-gate for GaAsFETs using I-line stepper and phase shift mask (PSM) PROCEEDINGS OF THE ELEVENTH INTERNATIONAL WORKSHOP ON THE PHYSICS OF SEMICONDUCTOR DEVICES, VOL 1 & 2, 2002, 4746 : 1437 - 1439
- [12] Lithographic performance at 0.3 to 0.35 micron patterns by using i-line stepper with off-axis illumination technology OPTICAL MICROLITHOGRAPHY IX, 1996, 2726 : 437 - 441
- [13] Sub-half-micron contact holes by I-line lithography using attenuated phase shift reticles GEC JOURNAL OF RESEARCH, 1996, 13 (01): : 11 - 16
- [15] Process development for 180-nm structures using interferometric lithography and I-line photoresist EMERGING LITHOGRAPHIC TECHNOLOGIES, 1997, 3048 : 309 - 318
- [16] A HALF-MICRON MANUFACTURABLE HIGH-PERFORMANCE CMOS TECHNOLOGY APPLICABLE FOR MULTIPLE POWER-SUPPLY APPLICATIONS 1989 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS: PROCEEDINGS OF TECHNICAL PAPERS, 1989, : 321 - 326
- [17] Lithography simulation of sub-0.30 micron resist features for photomask fabrication using I-line optical pattern generators 19TH ANNUAL SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2, 1999, 3873 : 484 - 492
- [18] Process and resolution enhancement using a new inorganic bottom anti-reflective layer for I-line lithography OPTICAL MICROLITHOGRAPHY X, 1997, 3051 : 204 - 214
- [20] A planarizing BARC 0.32 mu m i-line lithography process for the reduction of intra-die CD variation. OPTICAL MICROLITHOGRAPHY X, 1997, 3051 : 191 - 203